YCS Magnetic Curved Universal Silicone Tin Plainting Pad Anti Heating Insulation Base for Phones CPU IC BGA Reballing Repair

👍: 100.0%

Amaoe PD-C Tin Plainting Pad with Universal Mobile Phone BGA Chip Base for CPU IC BGA Reballing Stencil Rework Adsorption Repair

👍: 100.0%

Silicone PD-C Planting Tin Pad Reballing Platform Non-Slip Heat Resistance Magnetic Silicon Mat CPU IC BGA Stencils Rework Tools

👍: 100.0%

1Pcs 50g solder flux for Stainless steel/Nickel/copper soldering flux CPU IC BGA Oxidation spot welding Battery soldering paste

👍: 91.3%

1

中国版 中文国际版 International 京ICP备2023018498号-1